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[Analysis Case] Evaluation of Bonding State and Film Thickness of SiC Surface

In addition to detailed condition assessment, film thickness calculation is possible.

XPS can evaluate the chemical bonding state of the sample surface, and further detailed assessments can be made through waveform analysis. Additionally, by using assumed parameters in the waveform analysis results, it is also possible to calculate the thickness of surface oxide films, etc. In this document, we will introduce a case where the composition and state evaluation of the SiC surface was performed, along with the calculation of the oxide film thickness from the obtained peak intensity.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/19…

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For detailed data, please refer to the catalog.

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Applications/Examples of results

Analysis of power devices.

[Analysis Case] Evaluation of Bonding State and Film Thickness of SiC_C0394

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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!