[Analysis Case] Preprocessing Technology for Specific Areas of Wafers and Chips

We will sample only the target area and produce samples without breaking the wafer.

last updated Mar 13, 2025

FIB low acceleration processing

FIB: Focused Ion Beam Processing

last updated Mar 12, 2025

[Analysis Case] Evaluation of Impurity Concentration in AlGaN UV Sensors Using SIMS

A lineup of AlGaN standard samples with various Al compositions.

last updated Mar 13, 2025

[Analysis Case] SIMS Analysis of Compound Layered Structure Samples

Analysis is possible after selectively removing the compound layer through preprocessing.

last updated Mar 13, 2025

[Analysis Case] Composition Analysis of GaN-based LED Structures using SIMS

Capable of evaluating the composition of the main elemental components of GaN-based LEDs in the depth direction.

last updated Mar 13, 2025

[Analysis Case] Composition and Thickness Evaluation of Ultra-Thin SiON Films

Estimation of film thickness using the average free path of photoelectrons.

last updated Mar 13, 2025

[Analysis Case] Evaluation of Ultra-Shallow Implant Profiles by SIMS

Evaluation of dopant distribution and junctions is possible even in extremely shallow regions.

last updated Mar 13, 2025

[Analysis Case] Visualization of Strain at Heterojunction Interfaces in Compounds

Lattice image analysis using the FFTM method

last updated Mar 13, 2025

[Analysis Case] Evaluation of Composition and Impurity Distribution of ZnO Films by SIMS

Visualization of in-plane distribution through imaging SIMS analysis.

last updated Mar 13, 2025

[Analysis Case] Component Identification of Foreign Substances Considering Thermal History

Proposal for the use of standard samples with aligned thermal history.

last updated Mar 13, 2025

[Analysis Case] Depth Direction Analysis of Polyimide Components

Evaluation of the depth direction of surface modification layers of polymers, resins, and films using TOF-SIMS is possible.

last updated Mar 13, 2025

[Analysis Case] Evaluation of Film-Forming Component Encroachment on the Back Surface of the Wafer

Quantitative evaluation of metal components is possible near the bevel area.

last updated Mar 13, 2025

[Analysis Case] Photoluminescence Analysis of White LEDs

Verification of the luminous characteristics of the chip and phosphor in white LEDs.

last updated Mar 13, 2025

[Analysis Case] Evaluation of Si Natural Oxidation Film Thickness

Estimation of film thickness using the average free path of photoelectrons.

last updated Mar 13, 2025

[Analysis Case] Diffusion Evaluation of Ga and Al in Si Substrate using SSDP-SIMS

Measurement avoiding the influence of high concentration layers using SSDP-SIMS.

last updated Mar 13, 2025

[Analysis Case] SSDP-SIMS Analysis of Mg in GaN-based LED Structure

It is possible to obtain the impurity profile in the GaN-based LED structure from the backside.

last updated Mar 13, 2025

[Analysis Case] Composition Analysis of Compound Semiconductors by SIMS

Capable of evaluating the composition of the main elemental components of compound semiconductors in the depth direction.

last updated Mar 13, 2025

[Analysis Case] Emission and Heat Generation Analysis of GaN-based Devices

Proposal for evaluation of breakdown voltage of GaN-based devices and surface heat distribution assessment.

last updated Mar 13, 2025

Precautions for Low-Temperature Photoluminescence Measurement

Photoluminescence method

last updated Mar 12, 2025

[Analysis Case] Evaluation of Composition and Bonding State of GaN Film by XPS

Evaluation will be conducted under measurement conditions tailored to the purpose.

last updated Mar 13, 2025

[Analysis Case] Removal of Organic Contaminants by Etching

We will remove surface contamination and conduct an evaluation using XPS.

last updated Mar 13, 2025

Valence evaluation of metal oxides by chemical shift

XPS: X-ray Photoelectron Spectroscopy

last updated Mar 12, 2025

Types and Characteristics of Electron Diffraction

TEM: Transmission Electron Microscopy

last updated Mar 12, 2025

[Analysis Case] Evaluation of Carrier Distribution in Near-Infrared VCSEL Using SMM

We can consistently perform everything from disassembly and processing of the implemented product to measurement of the diffusion layer.

last updated Mar 13, 2025

[Analysis Case] Polarity Evaluation of GaN by ABF-STEM Observation

Atomic-level observation is possible with the Cs collector-equipped STEM.

last updated Mar 13, 2025

[Analysis Case] Evaluation of the Condition of Foreign Matter with Surface Oxidation Film

Evaluation of aluminum hydroxide Al(OH)3 and aluminum oxide Al2O3 is possible.

last updated Mar 13, 2025

[Analysis Case] Contamination Assessment of Si Wafer Bevel Area

It is possible to evaluate both metal components and organic components simultaneously.

last updated Mar 13, 2025

[Analysis Case] Comprehensive Evaluation of Lighting Emitting Devices

We will conduct analysis of various materials, including the disassembly of LEDs, phosphors, and LED chips.

last updated Mar 13, 2025

[Analysis Case] Evaluation of Diffusion Layer Shape of Image Sensors Using SCM

We provide consistent support from sample disassembly to measurement.

last updated Mar 13, 2025

[Analysis Case] Comprehensive Evaluation of CMOS Sensors

Reverse engineering of smartphone components

last updated Mar 13, 2025