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[Analysis Case] Emission and Heat Generation Analysis of GaN-based Devices

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[Analysis Case] Emission and Heat Generation Analysis of GaN-based Devices

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c0309.jpg

Proposal for evaluation of breakdown voltage of GaN-based devices and surface heat distribution assessment.

We will introduce two measurement examples of effective failure analysis methods for GaN-based LEDs and high-frequency devices. By conducting lock-in thermal analysis on LED elements, it is possible to visualize the presence and timing of heat generation associated with light emission, allowing for the identification of specific areas that exhibit unique behaviors or characteristics. By performing emission microscopy observation on high-voltage, high-frequency devices, it is possible to capture the light emission associated with breakdown and identify areas with issues related to voltage resistance.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/96…

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Analysis of optical devices.

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[Analysis Case] Emission and Heat Generation Analysis of GaN-based Devices_C0309

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