[IP Method] Ar Ion Polishing Processing

The IP method is a type of polishing technique that uses ion beams for processing.

last updated Mar 12, 2025

Ar ion milling processing

This is a processing method for producing thin film samples for transmission electron microscopy with a thickness of less than 50 nm by performing mechanical polishing followed by finishing with a low-energy Ar ion beam.

last updated Mar 12, 2025

Ultramicrotome processing

This is a processing method for cutting bulk samples using a diamond knife to produce ultra-thin sections for transmission electron microscopy with a thickness of less than 100 nm.

last updated Mar 12, 2025

Treatment under non-atmospheric exposure

It is possible to evaluate the sample in its original state.

last updated Mar 12, 2025

[FIB] Focused Ion Beam Processing

FIB refers to a focused ion beam with a diameter ranging from a few nanometers to several hundred nanometers, which can be used to scan the sample surface to etch or deposit material in specific areas.

last updated Mar 12, 2025

Cryo processing

Cooling and hardening the soft sample to make it machinable.

last updated Mar 12, 2025

[Analysis Case] Investigation of the Causes of Wettability Changes Due to Plasma Treatment

Evaluation of the top surface of modified layers of polymers, resins, and films using TOF-SIMS is possible.

last updated Mar 13, 2025

SSDP-SIM

SSDP： Substrate Side Depth Profile

last updated Mar 12, 2025

Cross-sectional processing using the ion polish method.

A method for removing the surface of a sample by utilizing the sputtering phenomenon, where sample atoms are ejected from the sample surface.

last updated Mar 12, 2025

Electronic dyeing

By bonding heavy elements to polymer chains, the contrast of structures and forms derived from the polymers can be enhanced, allowing for clearer observation under an electron microscope.

last updated Mar 12, 2025

Laser processing

Using an ultra-short pulse laser with micron-level processing position accuracy, samples can be produced quickly and with low damage.

last updated Mar 12, 2025

Structural analysis using Xe-plasma FIB.

Precision processing/structural evaluation is possible over a wide area of several hundred micrometers.

last updated Mar 12, 2025

[Analysis Case] Evaluation of Resistance Values and Li Distribution in Secondary Battery Cathodes

Distribution of resistance values in the electrode cross-section, visualization of conduction paths, and comparison with ion distribution.

last updated Mar 13, 2025

[Analysis Case] Impurity Evaluation of MLCC Using Diagonal Processing MLCC

Evaluation of impurity distribution in ceramic layers using diagonal processing.

last updated Mar 13, 2025