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[Analysis Case] Evaluation of Film-Forming Component Encroachment on the Back Surface of the Wafer

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[Analysis Case] Evaluation of Film-Forming Component Encroachment on the Back Surface of the Wafer

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C0230.jpg

Quantitative evaluation of metal components is possible near the bevel area.

In semiconductor device manufacturing, it is necessary to remove metals remaining on the backside of the wafer from the perspective of improving yield, and it is important to quantitatively understand the amount of metal components remaining. To investigate the concentration distribution of metals remaining on the backside within a range of 500 µm from the bevel area, we conducted evaluations using TOF-SIMS. TOF-SIMS has the spatial resolution to detect metal components only near the bevel area, and by using standard samples with known concentrations, it is possible to quantitatively calculate the concentrations.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/35…

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Analysis of power devices, optical devices, LSI, and memory.

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[Analysis Case] Evaluation of Film-Forming Component's Encroachment on the Back Side of the Wafer_C0230

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