[Analysis Case] Depth Direction Analysis of Polyimide Components
Evaluation of the depth direction of surface modification layers of polymers, resins, and films using TOF-SIMS is possible.
Polyimide is a material that is used in various fields, including electronic components, due to its high heat resistance and excellent electrical insulation properties. Since surface modification can enhance adhesion to other materials, it is important to understand the state of the modified layer. In this study, TOF-SIMS measurements were conducted under sputtering conditions that minimize the degradation of organic components, allowing for the evaluation of polyimide components in the depth direction. Using GCIB (Ar cluster) for sputtering enables the measurement of the targeted organic components in the depth direction. *GCIB: Gas Cluster Ion Beam
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Applications/Examples of results
Analysis of lighting, displays, optical devices, LSI, memory, electronic components, and daily necessities.