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[Analysis Case] Preprocessing Technology for Specific Areas of Wafers and Chips

C0184.jpg
C0184.jpg

[Analysis Case] Preprocessing Technology for Specific Areas of Wafers and Chips

We will sample only the target area and produce samples without breaking the wafer.

We will extract small pieces from the wafer chip without breaking it and thin them down for high-resolution TEM observation and analysis. Furthermore, by cutting and preparing samples while leaving the areas to be analyzed, we will conduct TEM observation and analysis of the target areas from any desired direction and provide the data. Through advanced TEM sample preparation techniques, we will meet various observation, analysis, and evaluation needs.

MST HP

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For detailed data, please refer to the catalog.

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Applications/Examples of results

Analysis of LSI and memory.

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[Analysis Case] Preprocessing Technology for Specific Areas of Wafers and Chips_C0184

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