[Analysis Case] Comprehensive Evaluation of CMOS Sensors
Reverse engineering of smartphone components
We will introduce a case where lenses and CMOS sensor chips were extracted from commercially available smartphones and evaluated. Depending on the purpose, we created flat and cross-sectional surfaces through polishing and FIB processing, and confirmed the layered structure and layers using TEM and SEM. Furthermore, we identified the types of films using EDX. At MST, we can handle everything from disassembly to analysis in a consistent manner.
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Applications/Examples of results
Food analysis.