一般財団法人材料科学技術振興財団 MST Official site

Solder Wetting Test

Testing can be conducted using the solder pot balance method, solder ball balance method, and solder paste method.

It is compatible with both leaded and lead-free solder.

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basic information

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Applications/Examples of results

- Evaluation of solder wetting properties of electronic components - Evaluation of wetting properties of commercially available electronic components - Confirmation of solder wetting condition of plated products

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