Solder Wetting Test
Testing can be conducted using the solder pot balance method, solder ball balance method, and solder paste method.
It is compatible with both leaded and lead-free solder.
basic information
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Price range
Delivery Time
Applications/Examples of results
- Evaluation of solder wetting properties of electronic components - Evaluation of wetting properties of commercially available electronic components - Confirmation of solder wetting condition of plated products