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[C-SAM] Ultrasonic Microscopy Method

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[C-SAM] Ultrasonic Microscopy Method

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C-SAM is a non-destructive method for observing defects such as delamination within a sample.

C-SAM is also known as SAT: Scanning Acoustic Tomography. - It is effective for confirming the "bonding state of electrodes" and "adhesion of bonded wafers," which are difficult to verify with X-ray CT observations. - In addition to reflected waves, transmission waves can also be acquired.

Related Link - https://www.mst.or.jp/method/tabid/1335/Default.as…

basic information

By using sound waves, it is possible to observe the internal structure beneath the surface of the sample non-destructively, without being influenced by the optical properties of the sample. Due to the significant reflection at the interface with air, it is possible to observe voids and cracks present inside electronic component packages with high sensitivity. The determination of void locations is made based on the ultrasonic reflection waveforms at each measurement point.

Price information

The price varies depending on the measurement target, so please feel free to contact us.

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Applications/Examples of results

- Defect investigation of semiconductor package products - Defect investigation of internal electronic components - Investigation of voids at the silicon wafer bonding interface - Investigation of adhesion at the metal plate bonding interface - Defect investigation of surface-mounted LEDs - Investigation of adhesion of adhesives and adhesive tapes - Investigation of voids in ceramic materials *All samples require water resistance.

Detailed information

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