一般財団法人材料科学技術振興財団 MST Official site

Solder heat resistance test

We will evaluate the impact of thermal stress on electronic components in the implementation process.

Bake, perform moisture absorption pre-treatment to reproduce storage conditions, and after reflow, check for the occurrence of delamination or cracks.

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basic information

For more details, please contact us.

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Applications/Examples of results

Various electronic components for consumer goods and automotive applications.

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