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[Analysis Case] Investigation of Curing Temperature and Glass Transition Temperature of Epoxy Resin

C0220.jpg
硬化後の樹脂のDSC曲線.png

[Analysis Case] Investigation of Curing Temperature and Glass Transition Temperature of Epoxy Resin

C0220.jpg
C0220.jpg 硬化後の樹脂のDSC曲線.png

Evaluation of thermal properties by DSC (Differential Scanning Calorimetry) measurement.

For the two-component mixed epoxy resin, we investigated the curing temperature and the glass transition temperature (Tg), which is an indicator of heat resistance, using Differential Scanning Calorimetry (DSC). When measuring the resin before curing with DSC, it was confirmed that a rapid exothermic reaction began around 103°C (Figure 1). This was due to the polymerization (curing) of the resin occurring as a result of the temperature increase. Furthermore, after air cooling the cured resin to room temperature, a second DSC measurement was conducted, which confirmed a shift of the baseline towards the endothermic side due to the glass transition of the resin, with Tg being approximately 116°C (Figure 2).

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[Analysis Case] Investigation of Curing Temperature and Glass Transition Temperature of Epoxy Resin_C0220

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