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[Analysis Case] Investigation of Contamination Causes on Silicon Wafers

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[Analysis Case] Investigation of Contamination Causes on Silicon Wafers

c0110.jpg
c0110.jpg

Evaluation of contamination originating from gloves

In semiconductor device manufacturing, it is necessary to investigate what causes thin deposits that lead to defects in order to examine contamination processes. An analysis was conducted using TOF-SIMS on the deposits for which carbon was detected by EDX and quantified by XPS. When compared to the gloves used for standard samples in each process, similar trends were observed with gloves A and B. Furthermore, verification was performed by adhering the standard sample gloves to silicon wafers. As a result, it was found that they were similar to glove A. Adhering standard samples to silicon wafers for verification is an effective method.

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Analysis of LSI, memory, and electronic components.

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[Analysis Case] Investigation of Contamination Causes on Silicon Wafers_C0110

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