[Analysis Case] Electronic Components
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[Analysis Case] Electronic Components
We will introduce examples of electronic component analysis.
91~117 item / All 117 items
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[Analysis Case] Investigation of Voids Inside Bonded Wafers Using C-SAM
We will evaluate the internal structure of the device in a comprehensive manner.
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[Analysis Case] Component Analysis of Flux in Cream Solder
Comprehensively qualitatively analyzes the rosin, thixotropic agents, surfactants, and other components in cream solder.
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[Analysis Case] Analysis of Epoxy Resin Hardener
Structural estimation of the curing agent component of a two-component epoxy resin.
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[Analysis Case] Evaluation of Oxidation State of Cu Surface by XPS
Separation of components in the Cu spectrum, quantification, and calculation of film thickness.
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Angle-resolved HAXPES measurement
HAXPES: Hard X-ray Photoelectron Spectroscopy
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[Analysis Case] Qualitative Evaluation of Fiber Optic Core and Cladding
Qualitative and distribution evaluation of optical fiber materials is possible using TOF-SIMS.
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[Analysis Case] Component Analysis of Water Repellent Areas
TOF-SIMS enables wide-area imaging evaluation of multiple components.
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Case studies related to EV (Electric Vehicle) analysis
Analyze the EVolution of EV development!
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[Case Study] Quality Control through Surface Analysis
The surface adhesion components (such as polydimethylsiloxane) can be evaluated using TOF-SIMS.
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[Analysis Case] Heating SSRM Evaluation of Multilayer Ceramic Capacitors (MLCC)
Visualization of conduction paths (insulation degradation areas) within the dielectric.
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Total light transmittance measurement, total light reflectance measurement
By using an integrating sphere, it is possible to measure samples with surface roughness or thickness.
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[Analysis Case] Evaluation of Carrier Lifetime through Photoluminescence Lifetime Measurement
Insights into the carrier lifetime of SiC can be obtained from the luminous lifetime.
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[Analysis Case] Solder Wetting Test for Semiconductor Packages
It is possible to conduct solder wetting tests on electrodes after accelerated degradation testing.
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[Analysis Case] Evaluation of Fluoride Ion Concentration in Lithium-Ion Battery Electrolyte
Quantitative analysis of fluoride ions can be performed using NMR.
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[Analysis Case] Surface Shape Analysis of GaN Substrates
Visualization of step-terrace structures by AFM.
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List of reliability tests
Reliability Test
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Evaluation avoiding duplication of Oji Peak by HAXPES.
Comparison of spectra obtained from Ga line (HAXPES) and Al line/Mg line (XPS) measurements.
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[Analysis Case] Evaluation of the Imidization Reaction of Polyimide
The degree of imidization due to differences in heating conditions can be evaluated using XPS.
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[Analysis Case] Composition Analysis of UV Curing Resin
The identification capability is enhanced when combined with soft ionization methods.
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[Analysis Case] Qualitative and Structural Analysis of Resin (Synthetic Polymer)
Insights into molecular structure can be obtained through combined analysis using FT-IR and thermal decomposition GC/MS.
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[Analysis Case] Evaluation of Curing Degree of UV-Cured Resin by FT-IR
By capturing changes in functional groups, it is possible to evaluate the curing degree of UV-curable resins.
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[Analysis Case] Binding State Mapping by XPS
It is possible to evaluate the distribution of surface contamination and surface treatment on samples with mm-order precision.
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[Analysis Case] Wide-area Quantitative Mapping using XPS
It is possible to evaluate the composition distribution in an area of up to 70×70mm.
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[Analysis Case] Evaluation of Sn Surface State by XPS
It is possible to calculate the ratio by valence (divalent, tetravalent).
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[Analysis Case] Impurity Evaluation of MLCC Using Diagonal Processing MLCC
Evaluation of impurity distribution in ceramic layers using diagonal processing.
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[Analysis Case] Simultaneous Qualitative Analysis of Inorganic and Organic Contaminants/Adhesives on Wafers
Simultaneous measurement of inorganic and organic components in minute specific areas.
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[Analysis Case] Evaluation of Metal Impurities in the Metal Film and Interface of the Device
Impurities in films and interfaces such as plating can be evaluated using TOF-SIMS.
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