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[Analysis Case] Solder Wetting Test for Semiconductor Packages

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[Analysis Case] Solder Wetting Test for Semiconductor Packages

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It is possible to conduct solder wetting tests on electrodes after accelerated degradation testing.

In electronic devices that use a lot of semiconductors, each component is mounted by soldering. If defects occur in the solder joints, it can lead to malfunctions in the electronic devices. Therefore, evaluating the wettability of solder is important for assessing the reliability of components. In this study, we artificially degraded the samples to examine how the wettability of the solder changes. After the constant temperature and humidity test, it was found that the wettability of the electrode surface changed. Measurement methods: Constant temperature and humidity test, solder wettability test Product fields: Power devices, LSI/memory, electronic components Analysis purpose: Degradation investigation, reliability evaluation For more details, please download the materials or contact us.

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Analysis of power devices, LSI/memory, and electronic components.

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[Analysis Case] Solder Wetting Test for Semiconductor Package_C0699

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