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[Analysis Case] Composite Analysis of Specific Areas within Electronic Devices (C0572)

Non-destructive assessment of specific areas inside the device! Evaluation of detailed structure and composition information of specific areas through cross-sectional observation.

Our company offers technologies suitable for structural evaluation of electronic devices, and we propose analytical methods tailored to the observation field and objectives. In a case where we investigated specific areas of a device using X-ray CT and FIB-SEM, we first used X-ray CT to observe the internal structure of the entire sample and identify specific areas. Next, we used FIB-SEM to confirm the detailed structure of the specific structures identified on the vias. 【Measurement and Processing Methods】 ■[SEM] Scanning Electron Microscopy ■[SEM-EDX] Energy Dispersive X-ray Spectroscopy (SEM) ■X-ray CT Method ■[FIB] Focused Ion Beam Processing *For more details, please download the PDF or feel free to contact us.

Related Link - https://www.mst.or.jp/casestudy/tabid/1318/pdid/50…

basic information

【Product Field】 ■Electronic Components *For more details, please download the PDF or feel free to contact us.

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Applications/Examples of results

【Analysis Objectives】 ■Structural Evaluation ■Failure Analysis / Defect Analysis ■Product Investigation *For more details, please download the PDF or feel free to contact us.

[Analysis Case] Composite Analysis of Specific Areas within Electronic Devices_C0572

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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!