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[Analysis Case] Evaluation of Oxidation State of Cu Surface by XPS

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[Analysis Case] Evaluation of Oxidation State of Cu Surface by XPS

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Separation of components in the Cu spectrum, quantification, and calculation of film thickness.

From the analysis of the Cu2p3/2 spectrum and Cu Auger spectrum, it is possible to evaluate the bonding state, quantitative assessment, and film thickness of the Cu surface. Major application examples include the evaluation of CMP processing and cleaning of Cu wiring, as well as the investigation of rust and discoloration of Cu electrodes. We will summarize the surface states of Cu treated with various processes and the thickness of the oxide film. (Measurements can be conducted immediately after treatment in a clean room environment.)

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Measurement method: XPS Product field: LSI, memory, electronic components Analysis purpose: Evaluation of chemical bonding state, composition evaluation, identification

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[Analysis Case] Evaluation of Oxidation State of Cu Surface by XPS_C0047

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