All products and services
511~540 item / All 787 items
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Reverse bias test
Reverse Bias Test
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Transient thermal resistance measurement
Transient Thermal Resistance Measurement
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Power cycle test
Power Cycling Test
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[FIB-MS] Focused Ion Beam Mass Spectrometry
This is a method that allows simultaneous shape observation and elemental imaging of small areas using a FIB and a TOF mass spectrometer mounted on an SEM device.
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Weather resistance test
Weather Resistance Test
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[EPMA] Electron Probe Micro Analyzer
By analyzing the characteristic X-rays generated when a finely focused electron beam is irradiated onto the surface of a solid sample in a vacuum, insights can be gained regarding the identification of elements and quantitative values.
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[NMR] Nuclear Magnetic Resonance Analysis
Nuclear Magnetic Resonance
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[MALDI-MS] Matrix-Assisted Laser Desorption Ionization Mass Spectrometry
It is a type of ionization method in mass spectrometry that is a soft ionization technique capable of suppressing the fragmentation of sample molecules.
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Fluorometric method
It is a method for observing the light emitted when electrons, excited by the irradiation of light on a substance, return to the ground state.
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Hard X-ray Photoelectron Spectroscopy
HAXPES is an analytical method that uses hard X-rays as the excitation light for XPS (X-ray photoelectron spectroscopy).
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[PFM] Piezoelectric Response Microscope
By using a probe coated with a conductive film and applying an alternating voltage to the sample surface, the sample surface is vibrated to obtain electromechanical information.
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Thermal shock test
We evaluate the durability of electronic components and devices when repeatedly exposed to high and low temperatures.
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Joint strength test
We evaluate the bonding strength of products and parts.
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Vibration test
We evaluate the effects of vibrations and durability on electronic components, electronic devices, and other products during use or transportation.
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Impact test
We evaluate the impact of shocks and durability that electronic components, electronic devices, and other products experience during use or when dropped.
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Constant temperature and humidity test
It is possible to evaluate the resistance when a certain load (temperature, humidity, pressure, voltage) is applied to materials and components.
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Air tightness test
We evaluate and determine the sealing performance of sealed states in hollow structure components and the like.
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Solder Wetting Test
Testing can be conducted using the solder pot balance method, solder ball balance method, and solder paste method.
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Solder heat resistance test
We will evaluate the impact of thermal stress on electronic components in the implementation process.
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TCC (Rapid Temperature Change) Test
Temperature cycle testing is possible with sample temperature control and air temperature control.
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PIND test
By detecting the sound generated when tiny foreign objects inside the hollow structure collide with the wall, it is possible to prevent troubles such as shorts before they occur.
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ESD test
We evaluate the effects and destruction tolerance when semiconductors and electronic components are subjected to stress from static electricity.
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[Analysis Case] Component Analysis of Additives in Rubber Products
We will conduct a comprehensive qualitative evaluation of vulcanization accelerators, aging inhibitors, lubricants, and other substances in rubber products.
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AFM Infrared Spectroscopic Analysis
Infrared spectroscopy is a method for obtaining information about molecular structure by measuring infrared absorption due to molecular vibrations.
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[O-PTIR] PTIR detection method submicron infrared spectroscopy
Infrared spectroscopy is a method for obtaining information about molecular structure by measuring the infrared absorption due to molecular vibrations.
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[AFM-MA・DMA] Mechanical Property Evaluation (Elastic Modulus and Dynamic Viscoelasticity)
AFM-MA and AFM-DMA are analyses that can provide insights into hardness.
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[TG-DTA, -MS] Thermogravimetric Differential Thermal Analysis, Differential Thermal Balance - Mass Analysis Method
TG-DTA simultaneously evaluates weight changes caused by heating (TG) and thermal behavior of endothermic and exothermic reactions (DTA).
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SSDP-SIM
SSDP: Substrate Side Depth Profile
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Cross-sectional processing using the ion polish method.
A method for removing the surface of a sample by utilizing the sputtering phenomenon, where sample atoms are ejected from the sample surface.
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Electronic dyeing
By bonding heavy elements to polymer chains, the contrast of structures and forms derived from the polymers can be enhanced, allowing for clearer observation under an electron microscope.
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