ダイヤモンド砥石
ダイヤモンド砥石
特殊ダイヤモンド砥石 ＵＮＩＶＡ－Ｘ（ユニバックス）
1～3 item / All 3 items
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Precision diamond grinding wheel
Achieved high-efficiency grinding of advanced electronic component materials! Capable of intake and exhaust of water and air.
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Diamond grinding stone "Dicing Blade"
Enables high-speed cutting of hard-to-machine materials such as sapphire, quartz glass, and silicon!
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Reduction of processing time for SiC and GaN | Porous diamond grinding wheel for clogging elimination
Ideal cutting performance and whetstone lifespan! Are you wasting your whetstone with dressing?
last updated