ダイヤモンド砥石

ダイヤモンド砥石
特殊ダイヤモンド砥石 UNIVA-X(ユニバックス)
1~4 item / All 4 items
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Precision diamond grinding wheel
Achieved high-efficiency grinding of advanced electronic component materials! Capable of intake and exhaust of water and air.
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Diamond grinding stone "Dicing Blade"
Enables high-speed cutting of hard-to-machine materials such as sapphire, quartz glass, and silicon!
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Reduction of processing time for SiC and GaN | Porous diamond grinding wheel for clogging elimination
Ideal cutting performance and whetstone lifespan! Are you wasting your whetstone with dressing?
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Special Diamond Grinding Stone "UNIVA-X SPECIAL"
A special grinding stone has been created that can surprisingly cut and polish hard materials like SiC and sapphire!
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