All products and services
1～30 item / All 37 items
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Diamond grinding wheels for semiconductor manufacturing for image sensors.
A grinding wheel that enhances the efficiency of microfabrication for image sensors.
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Diamond grinding wheels for semiconductor manufacturing for memory semiconductors.
Improving the efficiency of wafer polishing for hard-to-cut materials such as SiC and sapphire to enhance yield.
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High-Precision Porous Ceramic Vacuum Chuck for the Printing Industry
Positioning the sheet more accurately and smoothly.
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High-precision porous ceramic vacuum chuck for clean rooms
We support dust-free transportation in clean rooms with lightness and strength.
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High-precision porous ceramic vacuum chuck for robot hands
Even unusual shapes can be handled lightly and reliably. Innovating grip with unique ceramics technology.
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High-precision porous ceramic vacuum chuck for automotive parts manufacturing
Solving challenges in sensor fixation for automotive parts manufacturing with unique ceramics technology.
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High-precision porous ceramic vacuum chuck for optical lens manufacturing
Solving the challenges of lens holding. High-precision adhesion with unique ceramics technology.
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High-precision porous ceramic vacuum chuck for precision machining.
Float, stop, transport! Solving the challenges of component adhesion with unique ceramic sintering technology.
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High-precision porous ceramic vacuum chuck for LCD panel manufacturing
For fixing glass substrates. Solving challenges with unique ceramics sintering technology.
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High-precision porous ceramic vacuum chuck for semiconductor manufacturing
Solving the challenges of wafer transport! Uniform adhesion with unique ceramics sintering technology.
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Diamond grinding wheels for semiconductor manufacturing for substrate materials.
Grinding wheels that enhance the efficiency of wafer polishing for hard-to-machine materials such as SiC and sapphire.
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Diamond grinding wheels for semiconductor manufacturing for GaN wafers.
A grinding wheel that improves the surface quality of GaN wafers and enhances polishing efficiency.
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Diamond grinding wheels for semiconductor manufacturing for SiC wafers.
A grinding wheel that efficiently maintains the flatness of SiC wafers.
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Diamond grinding wheels for semiconductor manufacturing for power semiconductors.
A grinding wheel that improves the efficiency of SiC wafer polishing and contributes to enhanced heat resistance.
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Diamond grinding wheels for semiconductor manufacturing for logic semiconductors.
Grinding wheels that improve the efficiency of wafer polishing for hard-to-machine materials such as SiC and sapphire.
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AeroFix for Wafer Protection in Semiconductor Manufacturing
Achieving stable adhesion without deflection for wafer protection.
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Introduction case of 'Aerofix' capable of adhering thin films for logistics.
Adhesion technology that supports the efficiency of picking operations.
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"Aerofix" for preventing misalignment of thin films for printing.
Solving the film fixation issues in the printing industry. Without misalignment, beautifully.
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Diamond grinding wheel 'UNIVA-X SPECIAL' for semiconductor manufacturing
Grinding wheels that enhance the efficiency of wafer polishing for hard-to-machine materials such as SiC and sapphire.
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Special Diamond Grinding Stone "UNIVA-X SPECIAL"
A special grinding stone has been created that can surprisingly cut and polish hard materials like SiC and sapphire!
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High-precision porous ceramic vacuum chuck "Aerofix"
Float, stop, transport! We solve challenges with our unique ceramics sintering technology.
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Reduction of processing time for SiC and GaN | Porous diamond grinding wheel for clogging elimination
Ideal cutting performance and whetstone lifespan! Are you wasting your whetstone with dressing?
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Large Glass Substrate Processing Grinding Machine "NRG2000"
Achieving high-precision processing! Providing processing solutions for the flat panel display industry.
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Diamond grinding stone "Dicing Blade"
Enables high-speed cutting of hard-to-machine materials such as sapphire, quartz glass, and silicon!
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Precision diamond grinding wheel
Achieved high-efficiency grinding of advanced electronic component materials! Capable of intake and exhaust of water and air.
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Whetstone "UNIVA-X"
Ideal cutting performance and whetstone lifespan! Are you wasting your whetstone with dressing?
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NanoTem's contract system
A ready-to-use Nano-TEM SYSTEM! We will solve your problems!
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Comparative grinding energy
Appropriate processing rates under processing conditions! Providing suitable tools and equipment for various processing.
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Core technology: "Ceramics Sintering Technology"
The site will become ten times faster! We will realize the development of processing technology and tools based on innovative ideas.
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AeroFix Sample Loan
If there is an environment where factory air can be used, verification using workpieces can be easily conducted!
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