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Diamond grinding wheels for semiconductor manufacturing for memory semiconductors.

Improving the efficiency of wafer polishing for hard-to-cut materials such as SiC and sapphire to enhance yield.

In the wafer polishing of the memory semiconductor industry, high-precision processing and efficient material handling are required to improve yield. Particularly in the polishing of difficult-to-cut materials such as SiC and sapphire, reducing processing time and extending the lifespan of grinding wheels are key to enhancing productivity, reducing costs, and ultimately improving yield. The use of inappropriate grinding wheels can lead to decreased processing accuracy, material damage, and even production line stoppages. The special diamond grinding wheel "UNIVA-X SPECIAL" addresses these challenges and achieves high-efficiency processing and total cost reduction. 【Usage Scenarios】 - Polishing of SiC wafers - Polishing of sapphire wafers - Other wafer polishing of difficult-to-cut materials 【Effects of Implementation】 - Reduction in processing time - Cost reduction through extended grinding wheel lifespan - Achievement of high-precision polishing - Reduction in dressing frequency

Related Link - http://www.nano-tem.com/

basic information

【Features】 ■ Diamond abrasives arranged in SPIKE & SPIRAL shapes ■ Flexible shape design according to the type of material being ground ■ Promises high-efficiency processing and reduction of total costs ■ Reduces waste of grinding wheels during dressing ■ Load distribution can be controlled through diamond patterning 【Our Strengths】 We are engaged in the manufacturing and sales of special grinding wheels, vacuum suction plates, and surface grinding machines, as well as contract processing services for precision grinding, polishing, and dicing. For manufacturing and sales of special grinding wheels, vacuum suction plates, and surface grinding machines, you can rely on us. We also handle high-precision porous ceramic vacuum chucks, such as 'Aerofix.' Please feel free to contact us with your inquiries.

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『UNIVA-X SPECIAL』

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Whetstone "UNIVA-X SPECIAL"

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Our company is engaged in the manufacturing and sales of special grinding stones, vacuum suction plates, and surface grinding machines, as well as contract processing services for precision grinding, polishing, and dicing. We also handle high-precision porous ceramic vacuum chucks, such as "Aerofix." Please feel free to contact us if you have any inquiries.