ニデックアドバンステクノロジー 本社、東京営業所、名古屋営業所 Official site

Image inspection device for semiconductor package substrates "AURCA Series"

The "AURCA Series" image inspection device for semiconductor package substrates has arrived! It can also inspect printed circuit boards and wafers!

The AURCA series is a next-generation 2D appearance inspection system that integrates full-color high-speed scanning with AI technology, designed for high-density package substrates. With full-color imaging and a multi-effect optical configuration, it accurately captures a variety of defect characteristics. Furthermore, it goes beyond mere defect detection; the AI analysis function allows for the analysis of the shape and causes of detected defects! It supports the review of previous processes and the formulation of measures to prevent recurrence. ■ Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - Integrated detection of AI and conventional algorithms (hybrid inspection) - Minimizes miss rate and false detection rate to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Reduces inspection time by over 30% (supports high throughput mass production) ■ Example Inspection Items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign matter contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign matter, scratches, oxidation, corrosion, film cracks, bright spots

Related Link - https://www.nidec.com/jp/nidec-advancetechnology/p…

basic information

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Model number/Brand name

AURCA series

Applications/Examples of results

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Semiconductor package/printed circuit board appearance inspection device

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Our inspection target areas include printed circuit boards, semiconductor packages, and display panels. These are core components of information and communication devices that are growing increasingly due to advancements in IT, as well as widely adopted digital home appliances. Printed circuit boards, semiconductor packages, and display panels are evolving at an astonishing speed, and higher precision technologies are required in inspections. Our company holds a significant share in these inspection fields that demand cutting-edge technology, and we have delivered numerous products recognized as "de facto standards" in the industry worldwide.