All products and services
1~30 item / All 39 items
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Semiconductor tester for high-speed testing of MLCCs and IPDs.
Expansion of measurement conditions and built-in 64 LCR meters enable faster and more accurate inspections!
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High-precision inspection equipment for large individual semiconductor packages.
Overall positioning accuracy ±2.5µm! A high-precision inspection device ideal for inspecting large, multi-pin semiconductor package substrates.
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Large substrate HDI through-insulation inspection device 'GATS8360'
Supports a maximum of 112Kp up and down! Achieving multi-pin and high-precision inspection of large HDI boards.
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Semiconductor package multi-surface full panel substrate inspection device
Support for a total of 48K points in both vertical and horizontal directions! A high-speed inspection solution for multi-panel arrangements of large full-panel PCBs (500×620mm).
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TGV Through Hole Glass Substrate Inspection Device
The optimal imaging inspection device for TGV inspection has been completed!
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NS PROBE Miniaturization and Advanced Shapes
A probe that realizes miniaturization and diversification of advanced shapes using MEMS processes!
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Electrical testing for semiconductor package substrates - full panel size inspection available.
Full panel size support! A high-capacity, high-speed, and high-precision inspection solution compatible with a maximum point count of 24Kch.
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Automated Transport System "EFEM Series"
Equipment Front End Module Full Panel Size Compatible Automatic Transporter
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High-speed and high-precision inspection device for semiconductor packages 'GATS-7785'
Full panel size support! A high-capacity, high-speed, and high-precision inspection solution compatible with a maximum point count of 24Kch.
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Conductive Inspection Device "STAR REC V6"
Large-scale / Multi-pin Board Continuity Insulation Testing Equipment
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MEMS spring probe
Achieving the production of the world's smallest class springs!
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TC-Probe
Device temperature measurement probe
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Equipped with an autofocus mechanism! Image inspection device "AURCA Series"
Equipped with an autofocus mechanism to prevent distortion blur! Image inspection device "AURCA Series"
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RDL defect inspection, bump defect inspection, TSV defect inspection compatible appearance inspection equipment.
The sale of the appearance inspection device "AURCA series," which supports RDL defect inspection, bump defect inspection, and TSV defect inspection, has begun!
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AI-equipped visual inspection device for semiconductor wafers and panels "AURCA Series"
The AI-equipped appearance inspection device "AURCA Series" for semiconductor wafers and panels has arrived! It can also inspect semiconductor package substrates and printed circuit boards!
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Image inspection device for semiconductor package substrates "AURCA Series"
The "AURCA Series" image inspection device for semiconductor package substrates has arrived! It can also inspect printed circuit boards and wafers!
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Printed Circuit Board Image Inspection Equipment "AURCA Series"
AI inspection and measurement solution for printed circuit boards, image inspection device "AURCA Series"
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Electronic circuit board and semiconductor silicon wafer inspection equipment "AURCA Series"
AI inspection and measurement solution for electronic circuit boards and semiconductor silicon wafers: Introducing the "AURCA Series" appearance inspection equipment!
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Appearance inspection device "AURCA series" contributing to yield improvement.
Appearance inspection device "AURCA series" contributing to yield improvement.
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Full-color appearance inspection device "AURCA Series"
Full-color appearance inspection device "AURCA Series"
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AURCA Series
AI analysis function equipped!! Appearance inspection device
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High-speed STEP & REPEAT type continuity and insulation testing equipment
Achieves the highest class of high-speed and high-precision inspection in the history of the M6 series. Ideal for HDI and IC package board inspection.
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Large HDI substrate conductive insulation inspection device GATS
Supports high-density, multi-pin inspection. Achieves high-precision continuity and insulation testing for large HDI substrates and interposers.
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Analysis support tool "Pulse EYE"
Instantly analyze desired characteristic results from R&D to mass production testing! Analysis of test data from other companies is also possible.
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TDAS Series <Performance Test/Durability Test>
Supports ultra-high speed of 36,000 rpm! Cameras and various sensors can also be connected, enabling time-axis synchronized logging.
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IGBT/SiC Power Module Inspection Equipment "NATS Series"
Low LS 4.5nH! Introducing Nidec Advance Technology's inspection equipment.
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3D Measurement Device "NSAT Series"
Technology and reliability compatible with glass core! High-speed, high-precision 3D measurement device.
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NS Probe <Printed Circuit Board & Semiconductor Package Board Inspection>
A probe that achieves miniaturization and diversification of advanced shapes using MEMS processes!
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High-precision inspection jig
A 4-terminal fixture for measuring small resistances! Compatible with fine conductors and electrode pads.
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Continuity/Insulation Testing Tester 'RZ-1207'
Compatible with flat cables! Equipped with automatic mechanisms, manual mechanisms, and desktop mechanisms, etc.
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