All products and services
1~20 item / All 20 items
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Analysis support tool "Pulse EYE"
Instantly analyze desired characteristic results from R&D to mass production testing! Analysis of test data from other companies is also possible.
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TDAS Series <Performance Test/Durability Test>
Supports ultra-high speed of 36,000 rpm! Cameras and various sensors can also be connected, enabling time-axis synchronized logging.
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IGBT/SiC Power Module Inspection Equipment "NATS Series"
Low LS 4.5nH! Introducing Nidec Advance Technology's inspection equipment.
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Wafer bump automatic inspection system 'RWi-300MK3'
Ideal for gold bump 3D inspection! Achieves simultaneous measurement of 3D/2D/SD with high speed and high precision.
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2D/3D inspection device 'RSH Series'
Support for high-density substrates! We offer a diverse lineup tailored to your needs.
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3D Measurement Device "NSAT Series"
Technology and reliability compatible with glass core! High-speed, high-precision 3D measurement device.
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NS Probe <Printed Circuit Board & Semiconductor Package Board Inspection>
A probe that achieves miniaturization and diversification of advanced shapes using MEMS processes!
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High-precision inspection jig
A 4-terminal fixture for measuring small resistances! Compatible with fine conductors and electrode pads.
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Continuity/Insulation Testing Tester 'RZ-1207'
Compatible with flat cables! Equipped with automatic mechanisms, manual mechanisms, and desktop mechanisms, etc.
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AC/DC MULTI TESTER "R-700 Series"
Micro-capacity inspection with high resolution! Capable of inspecting various products such as thin-film RF filters and accelerometers.
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High-Speed OPEN/LEAK Tester "R-5940"
IC multi-function inspection support! Equipped with an LCR meter developed in-house.
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High-speed S&R type electric inspection device 'STAR REC M6V SW'
Introducing products compatible with HDI/PCB substrates! High-speed/high-precision models available.
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Automatic Inspection Device for Printed Circuit Boards 'STAR REC V5III'
Equipped with a dual-side alignment mechanism! Compatible with the inspection of miniaturized printed circuit boards.
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Large HDI substrate continuity insulation testing device 'GATS-8350'
The overall alignment accuracy is ±5.0μm! Supports a maximum of 64K points up and down.
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High-speed and high-precision inspection device for semiconductor packages 'GATS-7862'
LUL can provide proposals tailored to your specifications! We accommodate a variety of automation requirements.
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High-speed and high-precision inspection device for semiconductor packages 'GATS-7836'
Overall alignment accuracy ±2.5μm! Inspection equipment for large individual pieces/quarter panels.
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High-speed and high-precision inspection equipment for semiconductor packages 'GATS-7760'
Double table/shuttle type! Inspection equipment for FC-CSP/large individual chip substrates.
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Power Module Inspection Device "NSAT Series"
Wide bandgap measurement technology! Achieving high throughput inspection of up to 144 UPH.
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Glass substrate compatible 3D measurement device "NSAT Series"
Advanced substrate support, high-speed and high-precision 3D measurement device! Depth 5μm, Line Space 2/2 compatible.
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Inspection probe compatible with ultra-fine pitch! 'MEMS Probe'
"Inspection probes compatible with ultra-fine pitch" Automatic production system from microfabrication to inspection.
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