Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-3×210-S
The largest heating plate size in the series, 630mm x 200mm, suitable for large objects and simultaneous creation! Made by Unitec Japan.
The "RSS-3×210-S" is a desktop vacuum solder reflow device that enables a maximum void-free rate of 0.01%, making it suitable for solving challenges related to no-clean and lead-free soldering. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The strong reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to accommodate a wide range of prototype development. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required in power devices and aerospace applications. **Features** - Rapid heating at a speed of 2°C per second, significantly reducing takt time due to water cooling - Near-zero in-plane temperature difference on the heating plate, allowing for uniform heating of large objects - Nearly exact realization of the set temperature profile, with high repeatability and almost zero overshoot - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen *We also accept requests for free demonstrations. Please feel free to contact us.* *For more details, please refer to the PDF document or feel free to reach out to us.*
basic information
【Specifications (Excerpt)】 ■ Device Size (WxDxH): 820x630x315mm ■ Device Weight: Approximately 100kg ■ Effective Object Size (WxDxH): 620mmx200mmx50mm ■ Maximum Reach Temperature: 300℃ ■ Heating Method: Cross-Array IR Heater (Bottom Heating) ■ Temperature Control Method: P.I.D. Control Method ■ Temperature Difference on Plate Surface: Within ±1.5% of Set Temperature ■ Maximum Heating Rate (Depends on Object's Heat Capacity): 120K/min. ■ Maximum Cooling Rate (Depends on Object's Heat Capacity): 90K/min. (T=300℃>200℃) ■ Chamber Vacuum Durability: 0.1Pa (10-3hPa) ■ Process Gas Supply Line: Mass Flow Controller x1 (Maximum Flow Rate: 5nlm) ■ Controller: 7-Inch Touch Panel Controller (SIMATIC TP-700) ■ Number of Profile Program Registrations: Up to 50 Programs ■ Number of Program Steps: Up to 50 Steps ■ Chamber Cooling Method: Water Jacket Method ■ Heating Plate Cooling Method: Water Cooling/Air Cooling (Can be Shared) *For more details, please refer to the PDF document or feel free to contact us.
Price information
5 million to 15 million yen (depending on the model and options)
Delivery Time
Model number/Brand name
RSS-3×210-S
Applications/Examples of results
【Applications】 ■ Solder reflow mounting without using flux ■ Functional material development fields (battery electrodes, conductive film materials, etc.) ■ Redox of metal surfaces such as electrodes and metal powders ■ Redox during sintering of silver nano and copper nano pastes (not just prevention) 【Delivery Achievements】 ■ Automotive industry (power devices for EV/HV and high-brightness LED mounting) ■ Medical applications (pacemakers, endoscopes, etc.) ■ Aerospace development industry (radar, artificial satellites, rockets, etc.) ■ Government-affiliated research institutions such as AIST and NICT, as well as national universities and private universities with engineering faculties *For more details, please refer to the PDF materials or feel free to contact us.
Line up（7）
| Model number | overview |
|---|---|
| VSS-300 | |
| RSO-200 | |
| RVS-210 | |
| RSS-3×210-S | |
| RSS-210-S | |
| RSS160-S | |
| RSS110-S |
