[In Development] High-Speed FC Bonder CB-2100 (Manufactured by Athlete FA)
A lineup of features that meet the needs of various factories! Industry-leading speed FCB (Flip Chip Bonder) specialized for small chips.
The "CB-2100" is a high-speed FC bonder that supports a variety of devices (5G/data communication/RFID). It incorporates the elemental technologies cultivated through years of FCB (flip chip bonder) manufacturing and follows the data obtained from structural analysis to accommodate mass production. We offer a lineup including the tabletop model "CB-200," the manual type "CB-505," and the semi-automatic type "CB-600." 【Features】 ■ Compatible with chip trays ■ Automatic cleaning of the head tip ■ Installation of HEPA filters and ionizers ■ Support for various devices (5G/data communication/RFID) ■ Mapping support ■ Production management support *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Lineup】 ■ Desktop Flip Chip Bonder "CB-200" ■ Manual Flip Chip Bonder "CB-505" ■ High Precision, Low Load Flip Chip Bonder "CB-600" ■ Ultra High Precision Flip Chip Bonder "CB-700" *For more details, please refer to the PDF document or feel free to contact us.
Price information
It may vary depending on the optional features, so please feel free to contact us.
Price range
P7
Delivery Time
OTHER
Model number/Brand name
Flip Chip Bonder CB-2100
Applications/Examples of results
【Applications】 ■Compatible with various packages in RFID, MEMS, 5G, data communication, millimeter-wave sensors, photonics, and AR fields. *For more details, please refer to the PDF document or feel free to contact us.
Line up（4）
| Model number | overview |
|---|---|
| CB-200 | Desktop Flip Chip Bonder |
| CB-505 | Manual Flip Chip Bonder |
| CB-600 | High Precision Low Force Flip Chip Bonder |
| CB-700 | Ultra High Precision Flip Chip Bonder |
