CO2 Laser Processing [Cu Direct Blind Hole Processing Results]

Focus on the micro-diameter processing capability of CO2 lasers and the technology for controlling resin diameter.

last updated Mar 10, 2025

CO2 Laser Processing [Through-Hole Processing Results]

5G high-frequency compatible products, with APP memory and technologies for thinning and reducing the diameter of the core layer, using CO2 laser drilling techniques for TH holes.

last updated Mar 10, 2025

CO2 Laser Processing [ABF Resin Direct Processing Results]

■ The densification of package substrates is progressing, and there is a demand for miniaturization using CO2 lasers. ■ Introducing examples of miniaturization processing using our VELA machine.

last updated Mar 10, 2025

[Contract Processing] CO2/UV Laser, Drilling, Router *Processing Examples

We also support processing of 5G and IoT-related materials! We can propose technical solutions based on your needs, such as processing with laser composites or performing high-precision back drilling.

last updated Feb 26, 2025

4-beam CO2 laser processing machine for package substrates 'ECO-TL4C'

Achieving processing in a short time with 2 tables and 4 beams. Contract processing for semiconductor packages and printed circuit boards is also possible. Demonstrations will be held at the exhibition.

last updated Mar 10, 2025