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CO2 Laser Processing [Through-Hole Processing Results]

TH.jpg

CO2 Laser Processing [Through-Hole Processing Results]

TH.jpg
TH.jpg

5G high-frequency compatible products, with APP memory and technologies for thinning and reducing the diameter of the core layer, using CO2 laser drilling techniques for TH holes.

TH (Through Hole) Processing Results ■No.1: Example of processing untreated substrate Cu direct board thickness 200μm 　　Hole diameter φ70μm ■No.2: Example of processing untreated substrate Cu direct thin board Board thickness 40μm to 100μm 　　 Hole diameter φ40μm to φ70μm

basic information

【Contract Processing Request】【Specification Inquiry】 ■For contract processing requests and specification details, please contact us through the inquiry section on this page.

Price range

Delivery Time

Model number/Brand name

Vela

Applications/Examples of results

[Usage/Examples of Achievements] ■For inquiries regarding contract processing requests or specification details, please contact us using the inquiry section on this page.

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TH (through hole) processing result

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