UV laser processing [High frequency / 5G compatible substrate processing]

We are challenging the processing of new substrate materials compatible with high frequency, 5G, and automotive applications, with the cooperation of substrate material manufacturers and substrate manufacturing companies.

last updated Mar 10, 2025

UV laser processing [Direct processing of ABF material resin]

■ It is possible to process ABF material blind holes with a high taper ratio and uniform hole bottom quality. ■ The minimum hole diameter is φ10um, allowing for control of processing quality.

last updated Mar 10, 2025

UV laser processing [copper foil removal processing]

■ Trepanning processing with a diameter of 25um or more is possible using a very small diameter beam. ■ Punching processing with a minimum diameter of 10um is possible only for thin copper foil.

last updated Mar 10, 2025

UV laser processing [Flexible substrate processing]

High-quality blind hole and through hole processing is possible by combining trepanning and punching. Router processing using ultra-small diameter beams is also possible.

last updated Mar 10, 2025

UV laser processing [Router (contour) processing]

■High-quality cutting of multilayer substrates using ultra-small diameter beams is possible. ■Not only linear processing but also processing of irregular shapes including curves is possible.

last updated Mar 10, 2025

UV & CO2 composite laser processing

We are proposing a more reliable laser processing method that leverages the characteristics of both UV lasers and CO2 lasers.

last updated Mar 10, 2025

[Contract Processing] CO2/UV Laser, Drilling, Router *Processing Examples

We also support processing of 5G and IoT-related materials! We can propose technical solutions based on your needs, such as processing with laser composites or performing high-precision back drilling.

last updated Feb 26, 2025