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UV laser processing [Flexible substrate processing]

フレキシブル UV.jpg

UV laser processing [Flexible substrate processing]

フレキシブル UV.jpg
フレキシブル UV.jpg

High-quality blind hole and through hole processing is possible by combining trepanning and punching. Router processing using ultra-small diameter beams is also possible.

4. Flexible substrate processing ■No.4-1: Example of blind hole processing for single-sided flexible substrates with diameters from φ20um to φ50um ■No.4-2: Example of blind hole processing for double-sided flexible substrates with diameters from φ25um to φ100um

basic information

【Contract Processing Request】【Specification Inquiry】 ■For contract processing requests and specification details, please contact us through the inquiry section on this page.

Price range

Delivery Time

Applications/Examples of results

【Usage/Examples of Achievements】 ■For inquiries regarding contract processing requests or specification details, please contact us through the inquiry section on this page.

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Flexible substrate processing

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