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UV laser processing [copper foil removal processing]

銅箔 UV.jpg

UV laser processing [copper foil removal processing]

銅箔 UV.jpg
銅箔 UV.jpg

■ Trepanning processing with a diameter of 25um or more is possible using a very small diameter beam. ■ Punching processing with a minimum diameter of 10um is possible only for thin copper foil.

3. Copper foil removal processing ■No.3-1: Example of punching processing with a diameter of φ10um to φ30um (t1.5um copper foil) ■No.3-2: Example of trepanning processing with a diameter of φ25um to φ100um (t5um copper foil)

basic information

【Contract Processing Request】【Specification Inquiry】 ■For contract processing requests or specification details, please contact us through the inquiry section on this page.

Price range

Delivery Time

Applications/Examples of results

【Usage/Examples of Achievements】 ■For inquiries regarding contract processing requests or specification details, please contact us using the inquiry section on this page.

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Copper foil removal processing

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