UV laser processing machines (nanosecond, picosecond, etc.) 【contract processing, equipment sales】

Equipped with a high-speed UV oscillator with a wavelength of 355nm! A laser processing machine that also supports ultra-small diameter processing from 10μm to 30μm.

The "Vela UV" is a laser processing machine equipped with a high-speed UV oscillator operating at a wavelength of 355nm. It performs high-speed, high-precision micro-diameter processing of printed circuit boards and other materials. Additionally, it allows for the selection of suitable laser sources based on materials and purposes. The two-axis configuration enables high-speed processing of two workpieces simultaneously. 【Features】 ■ Ability to select suitable laser sources based on materials and purposes ■ High-speed processing of two workpieces simultaneously due to the two-axis configuration ■ Capable of micro-diameter processing from 10μm to 30μm ■ Comfortable operability with in-house developed CNC ■ Support for test processing ■ Contract processing and equipment sales *For more details, please refer to the PDF document or feel free to contact us.

basic information

【Specifications (Partial)】 ■Model: AVIA NX 355-40 / 355-30 / 355-25 ■Rated Output ・355-40: 40W ・355-30: 30W ・355-25: 25W ■Pulse Energy ・355-40: 308μJ @ 130kHz ・355-30: 250μJ @ 120kHz ・355-25: 250μJ @ 100kHz ■Central Wavelength: 354.7nm *For more details, please refer to the PDF document or feel free to contact us.

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Model number/Brand name

Vela

Applications/Examples of results

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Laser processing machine "Vela UV"

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Notice of Participation in the 'Total Solutions Exhibition for Electronic Devices 2025' from June 4 (Wednesday) to June 6 (Friday), 2025.
- Seminar・Event
Daifune Corporation Japan will exhibit at the Total Solution Exhibition for Electronic Devices 2025 held at Tokyo Big Sight. We will showcase cutting-edge laser processing technologies (femtosecond/picosecond/UV/CO2) equipped with our own developed CNC, optical, and control technologies that support advanced packaging technologies such as "FO-WLP," "FO-PLP," "CPO," and "AiP," as well as high-precision drilling technology, contour processing technology, and inspection. Please take a look at the various technologies that contribute to the advancement of embedded component technology and AI chip compatibility. [Exhibition Contents] ■ Proposals for various laser technology solutions Development/customization of customer-specific systems/optimal construction method proposals Contract processing: Support system from prototype processing to mass production ■ Proposals for drilling hole solutions Package substrate processing with 200,000 to 350,000/400,000 RPM spindle, double via hole processing HDI high-precision processing: Inner layer detection back drill function, axis CCD alignment function ■ Proposals for contour processing solutions Processing technology for optical modules: Axis CCD alignment function, counterboring processing ■ Proposals for various inspection technologies Laser blind hole inspection, hole position inspection, appearance inspection, and more.

May 30, 2025

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Distributors

大船企業日本

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At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.

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