Invitation to Exhibit at the 2019 Total Solutions for Electronic Devices Exhibition

Exhibition of CO2 and UV laser processing technology, hole drilling and contour processing machines, fully automatic AOI, and X-ray inspection equipment.

The Daifune Group is engaged in the manufacturing and sales of drilling machines and profile processing machines, as well as contract processing using various laser processing machines. At the "Total Solutions for Electronic Devices Exhibition 2019," starting on June 5, we will introduce our unique processing technologies and drilling/profile processing machines. We will also display actual models of fully automatic AOI and X-ray inspection equipment, and provide detailed explanations of the features of each product. [Exhibition Content] ■ CO2 and UV laser processing (we also accept prototypes for 5G laser processing) ■ Drilling machines and profile processing machines (processing technology for base stations, communications, and automotive substrates) ■ Fully automatic AOI (also for labor-saving, IoT, inline, and cloud applications) ■ X-ray inspection equipment (for multilayer boards) *You can view related product materials from the "PDF Download" section.

basic information

【Exhibition Information】Total Solution Exhibition for Electronic Devices 2019 Date: June 5 (Wednesday) - June 7 (Friday), 2019 Venue: Tokyo Big Sight, West Halls 1-4 Booth Number: West Hall 2, 2-227 《Introduction of some exhibition contents》 ■ Hole Processing Machines and Profile Processing Machines High-precision hole drilling machines for packages, automatic transport hole drilling machines, high-precision profile processing machines with countersinking functions ■ Fully Automatic AOI Achieving high-speed inspection at 500 panels/hr ■ X-ray Inspection Equipment (for multilayer boards) Balancing reasonable pricing with high performance *You can view related product materials from the "PDF Download."