Introduction to examples of inner layer copper foil machining.
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【Example of Inner Layer Copper Foil Engraving】 In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil, and we will introduce examples of such processing.
In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil. By using our touch-type engraving mechanism and accurately detecting the target copper foil position, we can achieve high-precision engraving processing.
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【Application】 ■ In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil. ■ By using our touch-type engraving mechanism, we can achieve high-precision engraving processing by accurately detecting the target copper foil position.
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At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.