Drill hole opening machine with inner layer detection back drill function
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■Detect the target inner layer position and perform back drilling based on that position information. ■Stable processing can be carried out while keeping the minimum stub remaining.
Inner Layer Detection Back Drill Function ■ The demand for "back drilling" to remove stubs to the target depth has been rapidly increasing due to the high-speed data communication of printed circuit boards. ■ In conventional back drilling, controlling the depth accuracy during stub processing (how effectively the stub can be removed close to the signal wiring layer) has been a challenge. ■ Our newly developed "inner layer detection back drill function" makes it possible to solve these issues. ■ By detecting the target inner layer position with a machine and performing back drilling based on that position information, stable processing can be achieved while keeping the minimum stub remaining.
basic information
【Purchase Inquiry】【Specification Inquiry】 ■For purchase inquiries or specification details, please contact us through the inquiry section on this page.
Price range
Delivery Time
Model number/Brand name
Vela
Applications/Examples of results
【Usage】 ■5G, IoT, communication board related
