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CO2 Laser Processing Example: Package Substrate Processing

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CO2 Laser Processing Example: Package Substrate Processing

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Case study of small diameter hole drilling for package substrates

Using our unique technology, we can ensure high-quality hole shapes and achieve the desired taper rate. This document details the processing of materials with a thickness of 32.5μm using a CO2 laser, down to a minimum diameter of φ30μm.

basic information

We sell our own developed laser processing machines (from CO2 lasers to nanosecond, picosecond, and femtosecond UV lasers), and we accept contract processing from test processing for product machining technology development to small-scale production sales during our customers' initial development stages. We specialize in technology development, so we can handle everything from the development of processing methods for new materials and products to contract processing for mass-produced items. Please feel free to consult with us.

Price range

Delivery Time

Model number/Brand name

Vela

Applications/Examples of results

Please consider our CO2 laser processing machine for the processing applications of package substrates.

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Vela-CO2 Laser Processing Case Study_PKG Substrate Processing

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