CO2 Laser Processing Example_Cu Direct TH Processing
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Cu Direct Double-Sided Through Hole Processing
In a case where through-hole processing was performed on a double-sided plate with a thickness of φ2μm using a CO2 laser processing machine, we control the cross-sectional shape of the through-holes according to the customer's needs using our unique technology.
basic information
We sell our own developed laser processing machines (from CO2 lasers to nanosecond, picosecond, and femtosecond UV lasers), and we accept contract processing from test processing for product machining technology development to small-scale production sales during our customers' initial development stages. We specialize in technology development, so we can handle everything from the development of processing methods for new materials and products to contract processing for mass-produced items. Please feel free to consult with us.
Price range
Delivery Time
Applications/Examples of results
Customers who wish to improve the processing quality of package substrate materials are encouraged to request processing tests from our company.
