UV Laser Processing Example: Package Substrate

Examples of micro-diameter hole processing for package substrates

Using the top-hat beam with a minimum beam diameter of φ10μm or less from our UV laser processing machine, we achieve high-quality drilling with a steep taper. This document includes processing examples with a minimum diameter of φ20μm for package material with a thickness of t25μm and a minimum diameter of φ10μm for package material with a thickness of t10μm.

basic information

We sell our own developed laser processing machines (from CO2 lasers to nanosecond, picosecond, and femtosecond UV lasers), and we accept contract processing from test processing for product machining technology development to small-scale production sales during our customers' initial development stages. We specialize in technology development, so we can handle everything from the development of processing methods for new materials and products to contract processing for mass-produced items and the manufacturing and sales of equipment. Please feel free to consult with us.

Price range

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Delivery Time

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Model number/Brand name

Vela

Applications/Examples of results

The electronic circuit boards are increasingly becoming smaller and more integrated, and new materials are being explored. Our company offers cutting-edge equipment and processing technology in new materials and microfabrication, so if you have any requests for joint technology development or similar, please feel free to contact us.

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Vela-UV Laser Processing Case Study_PKG Substrate

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Distributors

大船企業日本

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Phone number/address

At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.

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