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New 4-beam CO2 laser processing machine for package substrates

A new type of CO2 laser processing machine for PKG materials that quickly processes at high speed with four beams.

The manufacturing of electronic circuits for CPUs, which are becoming increasingly miniaturized, requires more precise processing. Therefore, the selection of processing machines is crucial, with quality and productivity being important factors. The "ECO-TL4C" from Ofuna Corporation Japan is a new type of CO2 laser processing machine that enhances the processing quality of substrate materials for packaging, including interlayer insulating film materials, through its unique functions, enabling efficient processing with two tables and four beams.

basic information

Our company sells in-house developed laser processing machines (from CO2 lasers to nanosecond, picosecond, and femtosecond UV lasers), and we accept contract processing from test processing for product machining technology development to small-scale production sales during our customers' initial development stages. We specialize in technology development, so we can handle everything from the development of processing methods for new materials and products to contract processing for mass-produced items. Please feel free to consult with us.

Price range

Delivery Time

Model number/Brand name

Vela

Applications/Examples of results

Daibune Corporation's "ECO-TL4C" in Japan is a new type of CO2 laser processing machine that enhances the processing quality of substrates for packaging, including interlayer insulating film materials, with its unique features, enabling efficient processing with two tables and four beams. For inquiries regarding high-quality, high-precision, and high-productivity processing of packaging materials, please contact us.

Vela-CO2 Laser TL4C Machining Case Study

OTHER

Vela-PKG new type CO2 laser processing machine for materials

OTHER

Recommended products

Distributors

At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.