Laser Blind Hole Inspection Device "LaserVia AOIM"
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Cost-effective inspection and measurement solutions that meet the demand for high-precision laser drilling processing!
The "LaserVia AOIM" is a laser blind hole inspection device that reduces the inspection time of HDI or ABF panels from several hours to just a few seconds. It inspects defective holes and provides effective statistical reports for managing and improving substrate production. It quickly scans various defects and ensures high quality in laser drilling processes. It offers powerful analytical tools to optimize and monitor the parameters and results of laser drilling. 【Features】 ■ Suitable for laser drilling processes of large windows, conformal, DLD, and flip chip ■ Dedicated and optimized detection algorithms for inspecting the size, position, and fine smearing of laser vias ■ Easy to learn and set up with one-touch operation ■ Capable of offline SPC analysis, with no additional scans required when changing to new defect inspection standards *For more details, please download the PDF or feel free to contact us.
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At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.