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"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Lester Corporation will be exhibiting at the 'JANOG57 Meeting in Osaka' held at the Congrès Convention Center in Grand Front Osaka. This meeting is a venue for not only network operators and administrators but also a diverse range of participants to gather and discuss. We plan to showcase "Busbar," "Liquid-cooled demo units," "Expanded Beam Optical (EBO) connectors," and "other optical connectivity solutions." We sincerely look forward to your visit.

The connection system compatible with stack configurations offers single pocket and multi-pocket PCB solutions. By accommodating various circuit sizes without the need for custom tools, it significantly reduces time to market. The female connector features one of the few pressure-operated mechanisms in the industry.

The stAK50h connection system, equipped with industry-approved terminal design, meets the connection needs for both signal communication and Ethernet while maintaining a low footprint through the use of an open-type hybrid header and receptacle. The stAK50h connector system is a robust and versatile compact single connection package that enables hybrid connections for Ethernet and signals. The modular header structure compatible with industry-approved AK terminals and stack configurations accelerates system design, and the hybrid connection performance is well-suited for applications such as radios, infotainment systems, vehicle control modules, and clusters.

Artificial intelligence (AI) and machine learning (ML) are rapidly growing fields of technology, and this growth is driving an increased demand for newer, faster, and more efficient data center infrastructure. As we move towards high-speed serial communication interfaces, we must address several key challenges in implementation to enable Ethernet technology at 3.2 terabits per port. To achieve this bandwidth, it will be necessary to either double the number of 224G lanes or improve the speed of each lane to operate at 448G.