Lester Corporation will be exhibiting at the 'JANOG57 Meeting in Osaka' held at the Congrès Convention Center in Grand Front Osaka. This meeting is a venue for not only network operators and administrators but also a diverse range of participants to gather and discuss. We plan to showcase "Busbar," "Liquid-cooled demo units," "Expanded Beam Optical (EBO) connectors," and "other optical connectivity solutions." We sincerely look forward to your visit.

The stAK50h connection system, equipped with industry-approved terminal design, meets the connection needs for both signal communication and Ethernet while maintaining a low footprint through the use of an open-type hybrid header and receptacle. The stAK50h connector system is a robust and versatile compact single connection package that enables hybrid connections for Ethernet and signals. The modular header structure compatible with industry-approved AK terminals and stack configurations accelerates system design, and the hybrid connection performance is well-suited for applications such as radios, infotainment systems, vehicle control modules, and clusters.

The connection system compatible with stack configurations offers single pocket and multi-pocket PCB solutions. By accommodating various circuit sizes without the need for custom tools, it significantly reduces time to market. The female connector features one of the few pressure-operated mechanisms in the industry.

Artificial intelligence (AI) and machine learning (ML) are rapidly growing fields of technology, and this growth is driving an increased demand for newer, faster, and more efficient data center infrastructure. As we move towards high-speed serial communication interfaces, we must address several key challenges in implementation to enable Ethernet technology at 3.2 terabits per port. To achieve this bandwidth, it will be necessary to either double the number of 224G lanes or improve the speed of each lane to operate at 448G.

We are currently hosting a webinar titled "Flexible Printed Circuits (FPC) with Japanese Subtitles." In today's ever-evolving environment, it is crucial for engineers in both the automotive and industrial sectors to incorporate more functionality into tighter spaces. As new communication protocols emerge, complexity increases, and power density and signal integrity are becoming more critical design elements. Significant investments are made in custom designs, making reuse essential. In this webinar, a senior manager from Molex's FPC division will share insights based on 14 years of design expertise, exploring how flexible printed circuits (FPC) address these modern challenges.

In today's rapidly changing environment, ensuring the predictability of the supply chain is essential. Intelligent demand planning, which combines advanced data insights with a strong collaboration framework, provides the resilience and agility that modern supply chains require. Based on seven years of experience gained since officially starting demand planning operations, Molex embarked on a large-scale reform of the process about three years ago. This reform focused on advanced demand sensing and tighter integration of S&OP and S&OE, as well as building a more cohesive and advanced system. The use of AI and advanced analytics is extremely important. The demand planning team at Molex quickly adopted these technologies, resulting in approximately a 20% improvement in forecast accuracy compared to previous methods. Molex is dedicated to an advanced demand planning process that integrates diverse functions and data sources, along with technologies like AI, to deliver visible results.