"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

Lester Corporation will be exhibiting at the 'JANOG57 Meeting in Osaka' held at the Congrès Convention Center in Grand Front Osaka. This meeting is a venue for not only network operators and administrators but also a diverse range of participants to gather and discuss. We plan to showcase "Busbar," "Liquid-cooled demo units," "Expanded Beam Optical (EBO) connectors," and "other optical connectivity solutions." We sincerely look forward to your visit.

We are currently hosting a webinar titled "Flexible Printed Circuits (FPC) with Japanese Subtitles." In today's ever-evolving environment, it is crucial for engineers in both the automotive and industrial sectors to incorporate more functionality into tighter spaces. As new communication protocols emerge, complexity increases, and power density and signal integrity are becoming more critical design elements. Significant investments are made in custom designs, making reuse essential. In this webinar, a senior manager from Molex's FPC division will share insights based on 14 years of design expertise, exploring how flexible printed circuits (FPC) address these modern challenges.