OCP Compatible NearStack Substrate Connector
Output through a 0.50mm SMT plug and thin cable assembly without going through the PCB!
We would like to introduce NearStack's "On-the-Substrate Connector," designed as a direct two-chip solution that we handle. The NearStack connector is placed directly on the chip substrate, enabling the "connectorization" of ASIC packages. High-speed transmission signals from the chip are output through a 0.50mm SMT plug and thin cable assembly without passing through the PCB. 【Features】 ■ 56 Gbps PAM-4 / 112 Gbps PAM-4 ■ Direct two-chip substrate wiring on the substrate connector ■ Direct placement of PCB plugs on the substrate surface *For more details, please download the PDF or feel free to contact us.
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Lester Corporation supports the manufacturing of electronics that underpin our daily lives through a variety of services, including the handling of semiconductors and electronic components. Additionally, as a system supplier for electronic devices, we propose optimal solutions across a wide range of fields such as broadcasting, video production, local governments, schools, and healthcare. Furthermore, amid growing concerns about global environmental issues like global warming, we contribute to reducing the environmental burden and realizing a sustainable society through business activities such as the deployment of mega-solar projects and the provision of energy management services.