Explanation of the third part "Power Connection Technology in the OCP ORV3 Rack"
We are introducing traditional power supply and its challenges, as well as the OCP ORV3 Rack configuration!
Traditionally, separate power supply units (PSUs) were installed for each function, supplying power to each card via a backplane or power cables. However, we faced the following major challenges: Challenges: - Limitations in power routing on the backplane due to increased current capacity - Increased costs from having separate power units for each function - Increased labor hours due to complicated routing with cables The OCP's proposed ORV3 (Open Rack v3) Rack aims to standardize power supply using large busbars, and the applicable connection connectors are also defined. We have released a video of the webinar, so please check it out through the related link below. *For more details, please download the PDF or feel free to contact us.
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Webinar: The Current State of High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers
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Lester Corporation supports the manufacturing of electronics that underpin our daily lives through a variety of services, including the handling of semiconductors and electronic components. Additionally, as a system supplier for electronic devices, we propose optimal solutions across a wide range of fields such as broadcasting, video production, local governments, schools, and healthcare. Furthermore, amid growing concerns about global environmental issues like global warming, we contribute to reducing the environmental burden and realizing a sustainable society through business activities such as the deployment of mega-solar projects and the provision of energy management services.