High-Performance Materials Week Nagoya Mobility Material Exhibition Exhibit [Heat Dissipation / Electromagnetic Wave Shielding Resin / Molded Products]

積水テクノ成型新事業開発部

Sekisui Techno Molding will be exhibiting at the High-Performance Materials Week Nagoya Mobility Materials Exhibition. Event Dates: 　　February 18, 2026 (Wednesday) 10:00 AM - 5:00 PM 　　February 19, 2026 (Thursday) 10:00 AM - 5:00 PM 　　February 20, 2026 (Friday) 10:00 AM - 5:00 PM Venue: 　　Port Messe Nagoya Booth Location: 　　Inside the Mobility Materials Exhibition 6-60 Exhibition Content: 　　Sekisui Techno Molding will showcase "Heat Dissipation and Electromagnetic Shielding Resins/Molded Products." We will also promote adaptation to the next-generation mobility sector, in addition to the automotive industry.

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Related product information

Thermal conduction molded products
Heat dissipation performance closer to metal materials than general-purpose resins! Proposing material and product design tailored to the quality requirements of various products.

For more details, please refer to the PDF document or feel free to contact us.
Injection-molded resin optimal for heat dissipation and EMC measures for various EV-related automotive components.
If it is a heat-dissipating and electromagnetic wave shielding resin molded product, EMC measures essential for e-Axle and on-board chargers (OBC) can also be achieved.

■Heat dissipation and electromagnetic wave shielding resin molded products ・Realization of high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Realization of electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
Lightweighting and cost reduction through the use of plastics around automotive ECUs [ECM measures].
Currently, metal housings/cases are mainstream for vehicle-mounted ECUs. By changing this to resin, weight reduction and cost savings can be achieved.

■Thermal Conductive Resin Molding Products ・Realization of high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) ・Realization of high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products ・Realization of high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Realization of electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
Promotional video [Heat dissipation and electromagnetic wave shielding resin molded products]
The video of the heat dissipation and electromagnetic wave shielding resin molded products has been completed.

■Thermal Conductive Resin Molding Products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) ・Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
Contributing to Sekisui's development products [heat dissipation, EMC, and weight reduction measures]!
Developed a resin that balances heat dissipation and electromagnetic wave shielding! Achieved approximately 45% weight reduction by converting from metal to resin.

■Thermal Conductive Resin Molding Products - Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) - Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products - Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) - Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω