セムテックエンジニアリング Official site

1-2 Comparison of Microhole Construction Methods

Methods and Technical Limitations of Micro-Hole Machining

When it comes to methods that can achieve a hole diameter of φ5μm, narrow pitch, and high precision, it narrows down to electroforming technology. The electroformed screens produced using this technology can achieve a robust structure (high reliability) with an aspect ratio (thickness ÷ hole diameter) of 10 or more, which is our company's unique technology. ≪Our production example≫ Material: Nickel Minimum hole diameter is 5μm, minimum pitch 15μm, thickness 100μm, aspect ratio (thickness ÷ hole diameter) = 20.

Related Link - http://www.semtech-eng.co.jp/

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Semtech Engineering Co., Ltd. specializes in ultra-fine processing using electroforming technology, as well as the development and contract manufacturing of ultra-high precision sieves and ultra-high precision fine molds. We excel in ultra-high aspect ratio technology that is impossible with etching, so please feel free to contact us with your inquiries.