Ultra high precision, ultra high aperture, ultra high durability! Electroforming technology!
Features of the groundbreaking precision sieve "Super Micro Sieve"!
At Semtech Engineering, we utilize a unique technology called electroforming to shape ultra-fine holes in metals. ≪Super Micro Sieve≫ - For the Super Micro Sieve with a sieve area of φ100mm: Ultra-high precision! Hole diameter φ10μm with an average allowable tolerance of ±0.5μm (keeping the variation in hole diameter within ±0.5μm across the entire sheet). Ultra-high open area! Pitch of 20μm with an open rate of 22.65% (the passing holes across the entire sheet account for one-fifth of the area, allowing for large-scale processing). Ultra-high durability! Aspect ratio of 10 (capable of processing a hole diameter of φ10μm with a sheet thickness of 100μm). The high thickness makes it less prone to damage. This technology has been adopted by three major companies that dominate the global market for functional particle production.
basic information
<<Our Production Examples>> - Ultra-fine filters/sieves - Special sensors - Micro parts (gears), etc.
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Applications/Examples of results
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