セムテックエンジニアリング Official site

3-2 Round Hole

Prototype example: high aspect ratio round hole

- Plate thickness ÷ hole diameter = aspect ratio - Minimum hole diameter φ5μm, plate thickness 50μm, aspect ratio: 10 - SEM photo image

basic information

In preparation

Price range

Delivery Time

Applications/Examples of results

For more details, please download the PDF or feel free to contact us.

Recommended products

Distributors

Semtech Engineering Co., Ltd. specializes in ultra-fine processing using electroforming technology, as well as the development and contract manufacturing of ultra-high precision sieves and ultra-high precision fine molds. We excel in ultra-high aspect ratio technology that is impossible with etching, so please feel free to contact us with your inquiries.