3-2 Round Hole
Prototype example: high aspect ratio round hole
- Plate thickness ÷ hole diameter = aspect ratio - Minimum hole diameter φ5μm, plate thickness 50μm, aspect ratio: 10 - SEM photo image
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Semtech Engineering Co., Ltd. specializes in ultra-fine processing using electroforming technology, as well as the development and contract manufacturing of ultra-high precision sieves and ultra-high precision fine molds. We excel in ultra-high aspect ratio technology that is impossible with etching, so please feel free to contact us with your inquiries.

























