Super High Reliability "Sieve" [Super Micro Sieve] *Original Technology Case
Introducing the innovative technology developed by Semtech Engineering. Adopted in ultra-high-definition innovations for 4K and 8K LCD TVs, computers, smartphones, and more.
Our company contributes to high reliability, top quality, and application-specific design through ultra-fine processing and ultra-high precision sieves using electroforming technology, as well as the development and contract manufacturing of high-pressure special-shaped holes. We have developed the ultra-high reliability 'sieve' super micro sieve and the classification device 'S-150W' that has mastered non-clogging classification technology, and we will continue to pursue innovative technologies in the future. **Features of Semtech Engineering's Innovative Technology:** - Established fine processing technology with hole diameters of 5μm, pitches of 15μm, thicknesses of 50μm, and ultra-high aspect ratios (thickness ÷ hole diameter). - Completely removes trace amounts of coarse particles that do not appear in the particle size distribution, with hole diameters of 5μm or more, at PPB levels during the manufacturing process. - Capable of creating approximately 160 million holes of 5μm in diameter over an area of 20 centimeters in diameter. *See Image 1. - Remarkable thickness of ≪30–100μm≫ with hardness HV600, which does not break even when dented. *See Images 2 and 3. - Application example: Special-shaped nozzles for spinning with high precision, high pressure, and an astonishing number of holes. *See Image 7 for processing example. - Designs hole shapes, hole diameters, and outer diameters according to usage purposes, in addition to sieves. *See Image 4. *For more details, please refer to the PDF document or feel free to contact us.
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